VC0401W系列

文件下載:VC0401系列

VC0101 Features

Typical voltage: 3V.
Radiating surface:1.45mmx1.6mm.
Ceramic size: 3.5mmx3.5mmx0.38mm.
High performance vertical chips deliver peak lumens with less radiating surface.
Window-less packaging improves optical coupling efficiency.
Low thermal resistance chip-on-ceramic substrate & ceramic-on-copper circuit board.
Matching copper circuit board:18mmx18mmx1.5mm.

VC0401 Features

Typical voltage: 12V.
Radiating surface:2.90mmx3.2mm.
Ceramic size: 7mmx7mmx0.38mm.
High performance vertical chips deliver peak lumens with less radiating surface.
Window-less packaging improves optical coupling efficiency.
Low thermal resistance chip-on-ceramic substrate & ceramic-on-copper circuit board.
Matching copper circuit board:27mmx28mmx3.0mm.

VC0401s Features

Typical voltage: 12V.
Radiating surface:2.03mmx2.39mm.
Ceramic size: 5mmx5mmx0.38mm.
High performance vertical chips deliver peak lumens with less radiating surface.
Window-less packaging improves optical coupling efficiency.
Low thermal resistance chip-on-ceramic substrate & ceramic-on-copper circuit board.
Matching copper circuit board:18mmx18mmx1.5mm.

VC0701 Features

Typical voltage: 21V.
Radiating surface:4.34mmx4.8mm.
Ceramic size: 18mmx18mmx0.38mm.
High performance vertical chips deliver peak lumens with less radiating surface.
Window-less packaging improves optical coupling efficiency.
Low thermal resistance chip-on-ceramic substrate & ceramic-on-copper circuit board.
Matching copper circuit board:36mmx36mmx3.0mm.

VC0901 Features

Typical voltage: 27V.
Radiating surface:4.34mmx4.8mm.
Ceramic size: 18mmx18mmx0.38mm.
High performance vertical chips deliver peak lumens with less radiating surface.
Window-less packaging improves optical coupling efficiency.
Low thermal resistance chip-on-ceramic substrate & ceramic-on-copper circuit board.
Matching copper circuit board:36mmx36mmx3.0mm.



VC0401W系列
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